The complete photolithography process is used for transferring patterns from a mask to a substrate. The equipment consists of 4 different equipment: coater (equipment to deposit of a photoresin) aligner (equipment that projects light to sensitize the photorresin through a mask), developer (equipment that eliminates sensitized photorresin) and hot plate ( used to harden the photoresin).
The final process of transferring the a pattern is performed by a selective etch, normally using a RIE process, the photoresin acts as a soft mask on the substrate.
Pattern transfer services can be provided to substrates such as silicon or glass wafers for any application where required. The resolution of the equipment is 1µ.
Model: WS-400B-8NPP Lite EDC-650-8TFM
Location: CENER Sarriguren