The PECVD equipment is used for the deposition of thin films of materials from precursors, gases containing the elements from which the desired film is formed, by the action of a plasma that breaks down the molecules. The equipment can deposit films of amorphous silicon, amorphous silicon doped with P, B as well as oxide and silicon nitride with different stoichiometry.
The RIE equipment is used for selective etching of different materials, by the action of a plasma containing ionized atoms, this dry etch occurs in a gaseous state.
The photograph below shows both equipment, equivalent in appearance, and on top the electronic control part associated with each equipment. Thin films deposit and selective etch services of different materials can be provided.
Manufacturer: Roth & Rau
Location: CENER Sarriguren