DEEP REACTIVE ION ETCHING (DRIE) EQUIPMENT FOR SILICON ETCHING WITH BOSCH PROCESS

Research institute: UPNA-Institute of Smart Cities
Manufacturer: Oxford Instruments Plasma Technology
Model: NGP80 ICP65
Location: UCTAI: Area Electronica. Sala Limpia. Edificio I+D Jerónimo de Ayanz. Campus Arrosadia. UPNA. Pamplona.